Simon Kamm

Abstract

Electronic devices are one of the key factors for recent advances in smart production systems or automotive. Reliability and robustness are key issues. To further increase this reliability, occurring failures in an electronic device has to be investigated in post-production failure analysis processes. One recent technique to detect and locate failures in electronic components is Time-Domain Reflectometry. This method offers the chance to detect several kinds of failures (e.g. a hard or soft failure) and localize the failure nondestructively. In theory, this can be determined following defined physical formulas. Nevertheless, the received signals are not perfect and mixed with noise from the measurement device or disturbed by nonoptimal material properties. In addition, complex architectures of devices are hard to model based on analytical models. Thus, these models solely are not sufficient for the failure analysis process. For this reason, a hybrid modeling approach is proposed, using a Machine Learning model in combination with physical models to detect and characterize the failure and its exact position. The Machine Learning model will be trained with simulated Time-Domain Reflectometry data.

Abstract

Im Sinne der Qualitätssicherung sollen zukünftig produzierte Halbleiterbauelemente den steigenden Anforderungen an Zuverlässigkeit, Konnektivität und Automatisierung standhalten. Dazu ist ein Fehleranalyseprozess notwendig. Um die Effizienz zu steigern und die Fehleranfälligkeit zu reduzieren, soll der Fehleranalyseprozesses mit dazugehöriger Datenanalyse automatisiert werden. Dafür muss zunächst ein Konzept für die automatisierte Integration heterogener Daten aus unterschiedlichen Datenquellen auf Basis aktueller Daten Engineering Methoden entwickelt werden. Die Daten aus unterschiedlichen Quellen (z.B. Produktionsdaten, Datenblätter, Analyseverfahren) müssen eindeutig einem Bauelement zugeordnet werden können und neue Daten oder Analyseergebnisse diesem hinzugefügt werden können. In diesem Beitrag wird für die automatisierte Datenintegration des Fehleranalyseprozesses von Halbleiterbauelementen ein Konzept mithilfe von Ontologien und Graphen vorgestellt und dessen Mehrwerte anhand eines Anwendungsfalls mit einer prototypischen Umsetzung diskutiert. Dafür wird ein hybrider Ontologie-Ansatz genutzt, um die heterogenen Daten in einem Knowledge Graphen zu verknüpfen. Der vorgestellte Ansatz ermöglicht sowohl eine lokale als auch eine globale Datenanalyse. Dadurch können sowohl bisher entwickelte Datenanalyse-Ansätze genutzt werden, als euch neue Algorithmen aufgebaut werden.

Abstract

The utilization of deep learning in the field of industrial automation is hindered by two factors: The amount and diversity of training data needed as well as the need to continuously retrain as the use case changes over time. Both problems can be addressed by industrial deep transfer learning allowing for the performant, continuous and potentially distributed training on small, dispersed datasets. As a specific example, a dual memory algorithm for computer vision problems is developed and evaluated. It shows the potential for state-of-the-art performance while being trained only on fractions of the complete ImageNet dataset at multiple locations at once.

Abstract

Ensuring and improving the reliability of electronic devices requires post-production failure analysis processes. One of the techniques to perform failure analysis for electronic devices is Time-Domain Reflectometry. With this method, failures can be detected, located, and characterized non-destructively. It enables not only the detection of hard interconnection failures (such as an open or a short) but also the detection and characterization of soft failures. For Time-Domain Reflectometry, known physical equations can be applied to model the ideal behavior of a signal for different failures. However, since electronic device architectures and thus the data become more and more complex and measurements are disturbed by noise or nonoptimal material properties, these models solely are not sufficient for failure analysis. Therefore we propose hybrid modeling, where machine learning models (e.g. convolutional neural networks) work together with physical models to detect, locate, classify and characterize the failure. The first approach is shown on simulated microstrip line data and then transferred to SiC transistors for evaluation.

Abstract

With the rise of the Internet of Things and Industry 4.0, the number of digital devices and their produced data increases tremendously. Due to the heterogeneity of devices, the generated data is mostly heterogeneous and unstructured. This challenges established approaches for knowledge discovery, which typically consume structured data from one source. The paper first describes aspects of data heterogeneity and their relevance for Industry 4.0 systems. Following, the upcoming challenges for different steps inside the knowledge discovery process for Industry 4.0 systems, such as for data integration and data mining, are discussed. Additionally, it mentions approaches to tackle them.

Abstract

Cyber-Physical Systems, characterized by networking capabilities and digital representations, offer many promising potentials for industrial automation. In an attempt to further enrich the system's digital representation by incorporating interdisciplinary models and considering a continuous and synchronized representation of it within the cyber layer, the concept of the Digital Twin emerged, enabling system monitoring, virtual commissioning, failure diagnosis and simulations by managing the Cyber-Physical Systems data along its lifecycle. To add further intelligence into the Digital Twin, the architecture of the intelligent Digital Twin was proposed. Nevertheless, managing and relating the complex and dynamic digital models as well as the heterogeneous data of the intelligent Digital Twin present open challenges. Due to their inherent extensibility and adaptability as well as their semantic expressiveness, Knowledge Graphs are a suitable concept to overcome these challenges and enable reasoning to gain new insights. Prominent applications of Knowledge Graphs are recommendation systems and exploratory search within the semantic web. However, there seems to be a lacking yet potential applicability for Knowledge Graphs in the industrial domain. Therefore, this contribution proposes a Knowledge Graph enhanced architecture of the intelligent Digital Twin, offering capabilities, which are internal linking and referencing, knowledge completion, error detection, collective reasoning and semantic querying. Based on the proposed concept, potential application fields for Knowledge Graph enhanced intelligent Digital Twin are addressed.

Abstract

In power electronic applications, transistors are a vital component. They are, however, susceptible to failures due to degradation of the interconnections and the chip itself. This paper presents a non-destructive approach for failure detection and location in power electronic devices using time-domain reflectometry. The proposed measurement and data generation method is applied to a silicon-carbide power transistor where several characteristics (R, L, C, open, short) and the location of the failure is simulated and characterized. Moreover, the method is also used to find the intrinsic properties of the transistor such as parasitic inductance and capacitance. The data generated is mapped to physical equations, however, the reflected signal of the time-domain reflectometry can be noisy due to multiple discontinuities in the transmission path. Therefore, the simulation and measurement data can be used to train hybrid machine learning models for parameter extraction which automates the failure analysis in Industry4.0 processes to ensure a smart and reliable manufacturing process.

Abstract

In this paper, a novel light-weight incremental class learning algorithm for live image recognition is presented. It features a dual memory architecture and is capable of learning formerly unknown classes as well as conducting its learning across multiple instances at multiple locations without storing any images. In addition to tests on the ImageNet dataset, a prototype based upon a Raspberry Pi and a webcam is used for further evaluation: The proposed algorithm successfully allows for the performant execution of image classification tasks while learning new classes at several sites simultaneously, thereby enabling its application to various industry use cases, e.g. predictive maintenance or self-optimization.